- Intel® Celeron™ J1900, N2930 or N2807 Quad Core
- Up to 8 GB DDR3L SDRAM
- 6x Serial Ports
- Dual Gigabit Ethernet
- VGA/DP/LVDS
- 7x USB Ports (6x USB 2.0, 1x USB 3.0)
- 2x SATA, 1x mSATA
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The AIMB-215 B1 with Intel Celeron J1900/N2930/N2807 processor is designed for industrial applications that require enhanced computing performance and power management capabilities.
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AIMB-230 is designed with the Intel HASWELL ULT Dual Core for industrial applications that require both performance computing and enhanced power management capabilities.
- Intel® Core™ i3, i5, i7 or Celeron Dual core Processor
- Up to 16 GB in 2x DDR3L SODIMM Sockets
- 2x RS232/485/422 Serial Ports
- 3x SATA III, 1x mSATA
- 2x Gigabit Ethernet
- eDP, LVDS, DP/HDMI, and DP++
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The SMARC-sXBTi Computer-on-Modules has been developed to comply with the SGET specification and is equipped with Intel® Atom™ processor E3800 series and up to 8 GB RAM, optional with ECC. They support the extended temperature range of -40°C to +85°C, measure only 82mm x 50mm and have an especially low-profile design thanks to the use of edge card connectors. Nevertheless, there is still enough space for up a 64GB on-board SSD to store OS and application data.
- Intel ATOM 3800 Series SOC
- up to 8GB DDR3L onboard
- 1x USB 3.0 & 3x USB 2.0
- eMMC Flash, SDIO, 2x SATA
- Industrial Temperature Option
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COM-BT CPU Board is a Type 6 COM Express module. It has an eDP interface allowing closed connection between the display device and the board ensuring that it is free from any external interference. COM-BT CPU Board is also capable of converting video signal through DDI0 and DDI1 going to DVI, DP, or HDMI gadgets or devices. COM-BT adopts the latest Intel® Celeron® J1900, N2930, N2807 and Atom™ E3800 Series product family. The system memory deploys with one DDR3L 1066/1333 MHz SODIMM up to 8 GB (4GB max for E3815/E3825/N2807). In addition, Intel® I211 supports Gigabit Ethernet that allows faster network connections. This model applies four PCI-Express〔x1〕 (one shared with Gigabit LAN). Moreover, two SATA 3.0Gb/s are configured on the COM-BT. COM-BT also equips USB2.0 x6, USB 3.2 Gen 1 x1 (combine USB2.0 x1) for flexible I/O expansions.
- Intel® Atom™/ Celeron® Processor SoC
- DDR3L 1066/1333 MHz SODIMM x 1, Up to 8 GB
- Gigabit Ethernet with Intel® Controller
- CRT, Up to 24-bit Dual-channel LVDS, eDP (Optional), up to DDI x 2 (Share w/ eDP LVDS)
- High Definition Audio Interface
- SATA 3.0 Gb/s x 2
- USB 2.0 x 7, USB 3.2 Gen 1 x 1
- PCI-Express [x1] x 3
- COM Express Compact Module, Pin-out Type 6, COM.0 Rev. 2.1
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COM-UCEBT adopts the latest Intel® Bay Trail Atom™ N2000/E3800 processor. The system memory deploys with onboard DDR3L 2 GB memory. In addition, Intel® I211/i210 supports 10/100/1000Base-TX that allows faster network connections. This model applies three PCI-Express〔x1〕, one LPC bus, and one SMBus. Moreover, two SATA 3.0Gb/s are configured on the COM-UCEBT. COM-UCEBT also equips six USB2.0 and one USB2.0/3.0 bus for flexible I/O expansions. The display of COM-UCEBT supports CRT/LCD simultaneous/ dual view display. This brand new COM Express Module is developed to cater to the requirements of Automation, Medical, ticket machine, transportation, gaming, KIOSK, and POS/POI applications.
- Intel® Atom™ E3800 Product Family/Celeron® N2000 Series SoC Processor
- COM Express Pin-out Type 10
- Onboard DDR3L 2 GB Memory
- Gigabit Ethernet
- 18/24-bit Single Channel LVDS LCDs & DDI
- 2x SATA, eMMC (Optional)
- 1x USB 2.0/USB 3.0 & 6 x USB2.0, GPIO 8-bit, 3 x PCI-Express [x1]
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The COMe-cAL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. A broad range of module variants, based on five different processor types, make up the COMe-cAL6 portfolio. Versions range from a cost optimized dual-core Intel Celeron (2x 1.1/2.4 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.6/2.0 GHz with 12W TDP) and Intel Pentium (4x 1.1/2.5 GHz with 6W TDP) versions for high-end applications.
- Intel Apollo Lake Pentium, Celeron, Atom E3900
- Low-power – performance/watt optimized form factor solution
- 2x SODIMM Up to 8 GByte DDR3L
- Triple Display outputs
- Industrial grade temperature
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The EMB-BSW1 is a new industrial motherboard with the N3000 series CPU. As its name suggests, the EMB-BSW1 utilizes the latest iteration of Intel’s SoC products that was geared specifically towards mobile devices.
- Intel® N3710/N3060 Processor
- Up to 8 GB DDR3L 1333/1600 MHz 2x SODIMM
- Three Independent Display: 2x HDMI & LVDS
- SATA 6.0 Gb/s x 3
- 4x USB 3.0, 2x USB 2.0
- Half-size Mini-Card (PCIe + USB),
- Full-size Mini-Card (mSATA)
- 12-24V DC
- Low Profile
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The EPIC-BT07 caters to the needs of the market through six COM ports, an interface still popular among most industrial users.
- Onboard Intel® Atom™ E3845 or Celeron® J1900/N2807 Processor
- Up to 8GB DDR3L SODIMM
- 6x serial ports
- 1x USB 3.0, 5x USB 2.0 Ports
- 2x Gigabit Ethernet
- VGA, HDMI & LVDS
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GENE-BT05 adopts Intel Celeron N2930/N2807 Processor. The system memory is deployed with 204-pin SODIMM DDR3L 1066/1333 up to 8 GB.
- Intel® Atom™ and Celeron® Processor
- 2x Gigabit Ethernet
- Up to 8GB of DDR3L memory
- VGA, LVDS and HDMI
- Onboard 4/5/8-wire Resistive Touch Screen Controller (Optional)
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MIO-2263 is a MI/O-Ultra SBC (Single Board Computer) with Embedded Intel Atom SoC J1900 2.0 GHz and E3825 1.33 GHz Processor.
- Embedded Intel® Atom™ E3825 Dual Core or Celeron J1900 Quad Core
- Up to 8GB DDR3 SODIMM
- 1x RS-232 & 1x RS-232/422/485/
- 4x USB 2.0 Ports & 1x USB 3.0 Port
- Gigabit Ethernet
- VGA, HDMI & LVDS
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MIO-5251 is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by the latest generation of Intel Celeron J1900 and Atom E3825 processors which have low power features but also good performance computing, especially for multimedia capabilities compared to earlier generations.
- Intel® Celeron J1900 & Atom™ E3825/E3845
- SODIMM up to 8GB DDR3L
- multi-display: VGA, LVDS & HDMI/DP*
- Flexible design using integrated multiple I/O: MIOe to approach vertical
- applications & keep domain knowhow
- 2x GbE, 4x COM, SATA, USB3.0, SMBus/I2C, GPIO
- full-size Mini PCIe w/ SIM holder, full-size mSATA or SD card