- Intel® Core™ i3, i5, i7 or Celeron Dual core Processor
- Up to 16 GB in 2x DDR3L SODIMM Sockets
- 2x RS232/485/422 Serial Ports
- 3x SATA III, 1x mSATA
- 2x Gigabit Ethernet
- eDP, LVDS, DP/HDMI, and DP++
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AIMB-230 is designed with the Intel HASWELL ULT Dual Core for industrial applications that require both performance computing and enhanced power management capabilities.
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AIMB-277 is Mini-ITX Industrial Motherboard for embedded applications, equipped with an LGA1200 socket for Intel® 10th Generation Core™/ Xeon Product Family Processor. Features
- Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipset
- Two 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAM
- Supports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)
- Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA III
- Supports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W Amplifier
- Supports ATX power
- Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Coming soon- The de next-TGU8 is a FEMTO-ITX (86 x 55mm) Smallest Single Board Computer, Intel Tiger Lake Core i-level CPU
- Onboard 11th Gen Intel Core i7/i5/i3 embedded Processor
- Up to 16 GB LPDDR4x memory onboard
- 2x 10/100/1000BaseT LAN (intel i225LM Intel i219LM network controllers with RJ45 jacks)
- 1x HDMI & 1x eDP(1x HDMI 1.4b, 1x eDP)
- 2x USB 3.2 Gen2, 4x USB 2.0
- 2x COM
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The EPIC-BDU7, harnesses the full potential of the processors’ Ultra Low Power (ULP) technology to bring its required wattage down to a mere 15W, allowing a fanless configuration.
- Onboard 5th Generation Intel® Core™ I3 or i5 Dual Core Processor
- Up to 8GB DDR3L SODIMM
- 4x Serial Ports
- 2x Gigabit Ethernet
- 2x USB 3.0, 4x USB 2.0 Ports
- VGA, DP2 and dual LVDS (Optional)/eDP (Optional)
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EPIC-SKU7 Board with 6th/7th Generation Intel® Core™ i-U series Processor
- 6th gen Intel® Core™ i5-6200U/Celeron 3855U Processor SoC
- Non-ECC DDR4 onboard (Up to 8GB)
- LVDS/eDP x 1 (Default: LVDS), HDMI x 1
- Intel GbE x 2 (210IT), SATA3 x 1 (7P + 15P right angle connector)
- USB 3.0 x 4 (Rear I/O), USB2.0 x 5 (Header x 1, rest in EXT I/O)
- Touch x 1 (via USB signal), HDA with Amp x 1
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EPIC-TGH7 Board with Intel® 11th Generation Xeon®/Core™ processors
- 11th gen Intel® Core™ i3, i5, i7-11850HE or Xeon W-11865MRE Processor SoC
- Non-ECC DDR4 onboard (Up to 64GB)
- 2x DP, 1x VGA, 1x LVDS, 1x HDMI
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The HPCIE-Q470 is a Half-Size PICMG® 1.3 single board computer with scalable CPU options of 10th/11th Intel® Generation Core™ i9/i7/i5/i3, Pentium® and Celeron® processors and Intel® Q470/Q470E chipset, supporting up to 10 cores.
- Intel Core i9/i7/i5/i3, Pentium or Celeron Socket LGA1200 processor options
- Up to 64GB DDR4 SODIMM memory
- Up to 2x RS-232/422/485
- Up to 5x USB 3.2, 1x USB 3.2 Type-C, 6x USB 2.0 Ports
- HDMI 1.4
- Dual Intel I225V 2.5 Gigabit Ethernet
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MIO-5271 is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by the latest generation of Intel Core U series processors which have low power features but also high performance computing and multimedia capabilities.
- Haswell 4th Gen Intel® Core™ U-series (i5/Celeron®)
- 1 x DDR3L-1600/1333 SO-DIMM support up to 8 GB
- DirectX11.1, OpenGL4.0, OpenCL1.2, 3 independent display: VGA + LVDS + HDMI/Displayport*
- Optimized thermal design with fanless solution for wide temperature
- Flexible design using integrated multiple I/O: MIOe
- Rich I/O interface with: 2x GbE LAN, HD Audio, 4x COM, 2x SATA, SMBus/I2C, 8x GPIO, Half-size Mini PCIe, Full-size Mini PCIe w/ mSATA & 2x USB 3.0
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MIO-5272 is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by 6th "SkyLake" generation of Intel Core U series processors which have low power features but also high performance computing and multimedia capabilities.
- 6th Gen Intel® Core™ U-series "SkyLake" (i7/i5/i3/Celeron®*)
- 2 x DDR3L-1600/1333 SODIMM support up to 16 GB
- DirectX 11.3, OpenGL 4.4, OpenCL 2.1, 3 independent displays: VGA + LVDS + HDMI
- Flexible design using integrated multiple I/Os: MIOe to approach vertical applications & keep domain knowhow.
- 2xGbE support, HD Audio, Rich I/O interface with 2x COM, 2x SATA, SMBus/I2C, GPIO, 2x Full-size Mini PCIe (one w/ mSATA), 4x USB 2.0, 2x USB 3.0 and TPM2.0*
- Supports Intel AMT11.0, WISE-PaaS/RMM and Embedded Software APIs
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MIO-5373 is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by the 8th generation of Intel Core series processors which have low power features but also high performance computing and multimedia capabilities.
- Dual Channel DDR4-2400 up to 32GB, onboard eMMC up to 64GB
- Triple simultaneous displays by 48-bit LVDS/eDP+HDMI+DP
- 2 GbE, 4 USB3.1, CAN Bus, M.2 B-Key 2280 supports NVMe, DC-in 12-24V
- iManager & SW APIs, WISE-PaaS/DeviceOn
- Optimized thermal design with fanless solution for wide temperature
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MIO-5375 fanless Industrial temperature 3.5" SBC is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by 11th generation of Intel® Core™ U series processors.
- 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 12W
- Dual Channel DDR4-2400 SODIMMs up to 64GB
- Quad simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional)
- Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe
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MIO-5393 is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by 9th/8th generation of Intel® Xeon®/Core™ H series processors.
- 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W
- Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU
- Triple simultaneous displays with 48-bit LVDS+HDMI+DP
- USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD
- Dual GbE, SATAIII, RS-232/422/485, CANBus, SMBus, I2C
- M.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230 8th Gen. Intel® Core™
