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  • EPC-R6410 is the RISC based box computer which integrated NXP i.MX6D/Q Cortex-A9 1.0GHz high performance processor. It is designed for the applications that require high performance and rich I/O but low power consumption. It supports dual display via HDMI and VGA up to 1080p, 1 Gigabit Ethernet, 6 USB 2.0 and 4 serials, as well as mini-PCIE for 4G/3G and M.2 for WiFi/BT. With wall mount brackets, fanless and dust-proof design, you can easy install in rugged environment.
    •  NXP ARM Cortex-A9 i.MX6 Dual/Quad 1GHz high performance processor
    •  On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash
    •  Supports Dual Display: VGA/HDMI
    •  Supports 1 x mini-PCIe, 4 x serial ports, 6 x USB, 1 x M.2 socket,8 x GPIO,1 x CAN
    •  Low power consumption, fanless design
    •  Supports Linux and Android BSP
  • Embedded Fan-less System with Intel® Braswell Celeron N3160/N3060, Atom E8000, DDR3L-1600MH SODIMM up to 8GB.
    • Intel® Braswell Celeron N3160/N3060, Atom E8000, DDR3L-1600MHz SODIMM up to 8GB
    • Fanless slim system with wall-mount & desk mount removable flange, default support VESA mount & Din-rail mount at bottom side
    • Supports 2 x Intel GbE, 8 x USB, HDMI, VGA, 4 x COM and 1 x Digital IO
    • Built-in 1 x full size mSATA and 1 x full size MiniPCIe w/SIM
    • Supports iManager, WISE-PaaS/DeviceOn and Embedded Software APIs
  • SIB-S201 is a small, fan-less embedded system. The size is no bigger than the palm of a hand and it supports Din rail/wall/desk mounting. SIB-S201 I/O is at the front and side, which is suitable for Din-rail assembly or other types of mounting. Reserve I/O ports are able to be upgraded with extension modules by demand. SIB-S201 is a semi-industrial system that allows for further extensions and is then equipped inside the machine cabinet. This system targets markets like Factory Automation, Equipment Integration, KIOSKs, and other space-limited machine equipment.
    • Intel® Braswell Celeron N3160/N3060, Atom E8000, DDR3L-1600MHz SODIMM up to 8GB
    •  Fanless slim system with wall-mount & desk mount removable flange, default support VESA mount & Din-rail mount at bottom side
    •  Supports 2 x Intel GbE, 8 x USB, HDMI, VGA, 4 x COM and 1 x Digital IO
    •  Built-in 1 x full size mSATA and 1 x full size MiniPCIe w/SIM
    •  Supports iManager, WISE-PaaS/DeviceOn and Embedded Software APIs
  • SIB-S202 is a small, palm-sized, fanless embedded system that supports Din rail/ wall/desk mounting. SIB-S202 features front I/O to ease DIN rail assembly and mounting. Rear I/O ports facilitate expansion and upgrade with extension modules on demand. SIB-S202 is a semi-industrial expandable system easily installed in machine cabinets. This system is designed for limited space machine equipment applications in factory automation, equipment integration, and kiosks.
    •  Intel® Atom™ E3900 series
    •  Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC
    •  Independent display by HDMI
    •  Semi-Industry Fanless slim systen, Din Rail or Wall mount design
    •  Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2
    •  Flexible expansion M.2 E key, F/S miniPCIe
    •  12V power input, default is 12V phoenix 2 pin connector
    •  Advantech WISE-PaaS/DeviceOn support
  • Mini-ITX Qseven V2.1 Carrier Board Development board for RISC Qseven module series
    • Supports Qseven V2.1 RISC module
    • Mini-ITX form factor
    • Dual display outputs HDMI 2.0 and 24-bit LVDS
    • Supports 1 x PCIe, 1 x GbE, 4 x USB 2.0, 1 x USB OTG2.0, 1 x SATAII, 1 x I2C, 1 x I2S, 1 x CANbus, 8 x GPIOs
    • Support AT/ATX mode, Input power +12V
  • The SOM-DB5800 is versatile SOM Carrier/Socket board ideal for evaluation and early development work. This Carrier is designed to work with all COM Express type SOMs. The SOM-DB5800 provides access to all the SOM's I/O through on-board connectors. Although a good deal of customers will want a Carrier that is unique and is designed specifically for their application, the DB5800 when coupled with a COM Express SOM makes for a nice ATX compatible embedded PC.
    • PICMG COM.0R 2.1 Type 6/10 Pin out
    • COM Express Basic/ Compact/ Mini module
    • VGA, LVDS, MDMI/ DisplayPort Riser Card
    • Visible Debug Utility: BIOS 8- Port and Power State
  • This product is EOL: SOM-AB5810 is the newest Mini-ITX application board. Featuring pin-to-pin compatibility with COM Express® Basic and Compact type 6 pin-out CPU modules compatible CPU models include SOM-5892 with 3rd Gen. Intel® Core™, SOM-5894, SOM-6894 with 4th Gen. Intel® Core™ and newer SOM modules. SOM-AB5810 supports both normal and wide-range temperature demands, as well as a choice of ATX power supply or DC-in 19V adapter. SOM-AB5810 is ideal for harsh environments and perfect for outdoor surveillance, industrial automation, digital signage, kiosk applications and much more.
    • Mini-ITX form factor with slim type I/O connector under 25.4mm
    • Compatible to COM Express Basic/Compact with Type 6 pin-out module
    • Supports Wide-range operating temperature from -40 to +85 degree
    • Supports Standard ATX Power or DC-in 19V
    • Supports VGA, 2xHDMI, PCIe x16, mini-PCIe, SATA, and USB3.0
  • The SOM-VDX3-ETX is a low-power CPU module which compliant with ETX standard. It takes advantage of the Vortex86DX 1GHz x86 CPU which integrates the PCIe, IDE, I2C, VGA, LVDS,PS/2, USB, HD Audio and even with 16-bit ISA bus support.  The VDX3-ETX is designed as a plug in replacement, with backward compatibility to support legacy software to help extend existing product life cycle without heavy re-engineering.
    • DM&P SoC CPU Vortex86DX3 1000Mhz
    • Up to 2GB DDR3 Memory Onboard
    • ETX, PCI and ISA Connections
    • 10/100 Ethernet, with Gigabit option
  • SOM-6894 is a COM Express Compact module with pin-out Type 6 that fully complies with the PICMG (PCI Industrial Computer Manufactures Group) COM.0 R2.1 specification. This product is designed with the latest Intel 4th generation ultra low power processors- Intel® Core™ i7-4650U, i5-4300U, i3-4010U, and Intel® Celeron 2980U which integrates the CPU and PCH onto one single chip. SOM-6894 has 15% CPU performance improvement than previous generation, GT3 graphics, and lower Thermal Design Power (TDP) 15W. To compare with previous versions, SOM-6894 delivers improved graphics performance with the latest Intel® HD graphics with DX 11.1, OGL 3.2, OCL 1.2 support. It can support dual and triple independent displays for even better media and display capabilities. In addition, SOM-6894 features up to 16GB of DDR3L 1600MHz nonECC un-buffered memory, 4 PCIe x1 (optional for 1 PCIe x4), 1 GLAN, 4 SATA, 2 USB 3.0, 8 USB 2.0, and 8 GPIO functions. Due to the outstanding performance, small form-factor, and rich expansion interfaces, this product is ideal for medical, digital signage, automation and surveillance applications.
    • Intel® Core™ i7/i5/i3/Celeron® processor
    • up to 16 GB DDR3 SODIMM
    • 8x USB 2.0, 2x USB3.0, 4x SATA, 1x GbE
    • 3 independent displays: VGA, LVDS, HDMI/DisplayPort/DVI
  • SOM-6896 is a new COM Express (PICMG COM.0) R2.1 Compact Module in a Type 6 pin-out module board. SOM-6896 is equipped with the latest 5th generation Intel® Core™ Processor on a compact size 95x95mm COM Express module, resulting in low power consumption and excellent CPU and graphics performance. SOM-6896 is built for use in demanding applications such as medical equipment, automation, and gaming industries. Compared with its predecessor, SOM-6896 is designed with the latest 5th generation Intel® Core™ Processor and supports DirectX 11.1, OpenGL 4.2 and OpenCL 2.0 and AVC/VC1/MPEG2 codec support. SOM-6896 supports 3 simultaneous displays (VGA, LVDS, HDMI/DisplayPort/DVI), and HDMI supports up to 4K (4096x2304) @ 24Hz resolutions. SOM-6896 provides flexible IO interface options with up to 3 PCIe x1 to fulfill various function extension requirements. In addition, SOM-6896 improves thermal performance with an added mounting hole designed around the CPU with a stronger board structure that avoids board bending - designed to improve thermal effect, it offers excellent connection between the module board and thermal solution.
    • 5th Gen Intel® Core™ i7/i5/i3/Celeron® processor
    • up to 16 GB RAM in 2x SODIMM sockets
    • 3 independent displays: VGA, LVDS, HDMI/DisplayPort/DVI
  • The COMe-cAL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. A broad range of module variants, based on five different processor types, make up the COMe-cAL6 portfolio. Versions range from a cost optimized dual-core Intel Celeron (2x 1.1/2.4 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.6/2.0 GHz with 12W TDP) and Intel Pentium (4x 1.1/2.5 GHz with 6W TDP) versions for high-end applications.
    • Intel Apollo Lake Pentium, Celeron, Atom E3900
    • Low-power – performance/watt optimized form factor solution
    • 2x SODIMM Up to 8 GByte DDR3L
    • Triple Display outputs
    • Industrial grade temperature
  • COM-BT CPU Board is a Type 6 COM Express module. It has an eDP interface allowing closed connection between the display device and the board ensuring that it is free from any external interference. COM-BT CPU Board is also capable of converting video signal through DDI0 and DDI1 going to DVI, DP, or HDMI gadgets or devices. COM-BT adopts the latest Intel® Celeron® J1900, N2930, N2807 and Atom™ E3800 Series product family. The system memory deploys with one DDR3L 1066/1333 MHz SODIMM up to 8 GB (4GB max for E3815/E3825/N2807). In addition, Intel® I211 supports Gigabit Ethernet that allows faster network connections. This model applies four PCI-Express〔x1〕 (one shared with Gigabit LAN). Moreover, two SATA 3.0Gb/s are configured on the COM-BT. COM-BT also equips USB2.0 x6, USB 3.2 Gen 1 x1 (combine USB2.0 x1) for flexible I/O expansions.
    • Intel® Atom™/ Celeron® Processor SoC
    • DDR3L 1066/1333 MHz SODIMM x 1, Up to 8 GB
    • Gigabit Ethernet with Intel® Controller
    • CRT, Up to 24-bit Dual-channel LVDS, eDP (Optional), up to DDI x 2 (Share w/ eDP LVDS)
    • High Definition Audio Interface
    • SATA 3.0 Gb/s x 2
    • USB 2.0 x 7, USB 3.2 Gen 1 x 1
    • PCI-Express [x1] x 3
    • COM Express Compact Module, Pin-out Type 6, COM.0 Rev. 2.1
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