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  • The HPCIE-Q470 is a Half-Size PICMG® 1.3 single board computer with scalable CPU options of 10th/11th Intel® Generation Core™ i9/i7/i5/i3, Pentium® and Celeron® processors and Intel® Q470/Q470E chipset, supporting up to 10 cores.
    • Intel Core i9/i7/i5/i3, Pentium or Celeron Socket LGA1200 processor options
    • Up to 64GB DDR4 SODIMM memory
    • Up to 2x RS-232/422/485 
    • Up to 5x USB 3.2, 1x USB 3.2 Type-C, 6x USB 2.0 Ports
    • HDMI 1.4
    • Dual Intel I225V 2.5 Gigabit Ethernet
  • The PCIE-Q470 is a full-size PICMG® 1.3 single board computer with scalable CPU options of 10th/11th Intel® Generation Core™ i9/i7/i5/i3, Pentium® and Celeron® processors and Intel® Q470/Q470E chipset, supporting up to 10 cores.
    • Intel Core i9/i7/i5/i3, Pentium or Celeron Socket 1200 processor options
    • Up to 128GB DDR4 U-DIMM memory
    • Up to 2x RS-232/422/485 
    • Up to 5x USB 3.2, 1x USB 3.2 Type-C, 6x USB 2.0 Ports
    • HDMI 1.4
    • Dual Intel I225V 2.5 Gigabit Ethernet
  • In a PICO-ITX form factor, APL-PITX-N3350, a standard Pico-ITX embedded solution for industrial applications based on Intel® Apollo Lake Dual-Core CPU with DDR3L RAM support up to 8GB, provides stable and powerful computing performance.
    • PICO-ITX : 3.9 x 2.8 inches (100 x 72mm)
    • Intel Celeron N3350
    • 2C/2U3/2U2/HDMI/LVDS/GLAN/SATA/M.2/Audio/8xGPIO
    • DDR3L SODIMM Up to 8GB
    • Operation Temperature: 0 ~ +60°C
  • In a PICO-ITX form factor, VDX3-PITX is designed for applications with size limitation requirements. VDX3-PITX featured on Vortex86DX3 1GHz SoC, supports 2GB DDR3 RAM, LAN, SATA DOM, Micro SD, 4x USB, 2x 8-bit GPIO, 8x 11-bit ADC, and Audio.
    • PICO-ITX : 3.9 x 2.8 inches (100 x 72mm)
    • DM&P SoC Vortex86DX3 - 1GHz
    • 4U/VGA/LAN/LPT/Audio/16GPIO/8x11-Bit ADC/SATA
    • 1GB / 2GB DDR3 onboard
    • Operation Temperature: -20 ~ +70°C (single Core)/ -10°C ~ +60°C (Dual Core)
  • Coming soon- The de next-TGU8 is a FEMTO-ITX (86 x 55mm) Smallest Single Board Computer, Intel Tiger Lake Core i-level CPU
    • Onboard 11th Gen Intel Core i7/i5/i3 embedded Processor
    • Up to 16 GB LPDDR4x memory onboard
    • 2x 10/100/1000BaseT LAN (intel i225LM Intel i219LM network controllers with RJ45 jacks)
    • 1x HDMI & 1x eDP(1x HDMI 1.4b, 1x eDP)
    • 2x USB 3.2 Gen2, 4x USB 2.0
    • 2x COM
  • The de next-V2K8 is a FEMTO-ITX Single Board Computer, the smallest SBC at 86 x 55mm based on the AMD Ryzen V2000 Embedded Processor Family
    • AMD RYZEN™ V2000 embedded Processor Family (V2718 8C/16T | V2516 6C/12T)
    • Up to 16 GB LPDDR4x memory onboard
    • 2x 10/100/1000BaseT LAN (intel i225LM and Realtek RTL8111H with RJ45
    • 1x HDMI & 1x eDP/LVDS(1x HDMI 1.4b, 1x eDP)
    • 2x USB 3.2 Gen2, 4x USB 2.0
    • 2x COM
  • MIO-5375 fanless Industrial temperature 3.5" SBC is designed using MI/O Extension form factor (compact series, 146 x 102 mm) and powered by 11th generation of Intel® Core™ U series processors.
    • 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 12W
    • Dual Channel DDR4-2400 SODIMMs up to 64GB
    • Quad simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional)
    • Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe
  • The RSB-3720 IMX8M Industrial ARM Board is an industrial temperature ARM Single board computer, with a Machine Learning Enabled, Neural Network Accelerator
    • NXP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz
    • Onboard LPDDR4 4 GB / 6 GB
    • HDMI 1920x1080 at 60Hz (or 1 4-Lane MIPI-DSI by BOM Option)
    • Supports Yocto Linux, Android and Microsoft Windows 10 IoT Base
  • The VDX3-6726 is a low-power CPU module compliant with ISA standards. It takes advantage of Vortex86DX3 1GHz x86 CPU which integrates the SATA, I2C, VGA, LVDS, PS/2, USB, HD Audio, and even the 16-bit ISA bus support.
    • DM&P SoC Vortex86DX3 - 1GHz
    • 4S/4U/VGA/LCD/LVDS/2GLAN/LAN/LPT/Audio/16GPIO/SATA
    • 1GB / 2GB DDR3 onboard
    • Operation Temperature: -20 ~ +70°C / -40 ~ +85°C (Optional)
    • PC/104 Connector Onboard
    • Optional: CH375 DOS USB Hot Swap
  • ROM-DB5901 SMARC Development carrier board designed for evaluation of the SMARC v2.0 modules. It supports a wide range of operating temperatures, two power input interfaces, and two MIPI connectors for the camera module. ROM-DB5901 is an ideal development board for mobile applications, such as portable devices, industrial tablets or HMI systems.
    • 4 kinds of display outputs, 18/24-bit LVDS or MIPI DSI, HDMI, DP
    • 2x MIPI-SCI2 interfaces for camera module
    • Supports +12V DC and lithium-ion battery power input
    • Operating Temperature -40°C to 85°C
  • The ROM-5722 NXP IMX8M Plus SMARC 2.1 Computer-on-Module is powered by NXP i.MX8M Plus SOC which includes up to 4 Arm Cortex-A53 cores in combination with one Cortex-M7 real-time processor and Vivante GC7000UL graphics engine. The ROM-5722 industrial ARM System-On-Module provides USB2.0, USB3.2 Gen1By1, dual Gigabit Ethernet, MIPI-CSI, PCI Express, and Dual channel LVDS shared with MIPI-DSI for embedded applications.
    • NXP i.MX 8M Plus processor with dual or quad ARM Cortex A53 cores
    • 1x Arm Cortex-M7 core
    • up to 6 GB LPDDR4 Onboard memory and 16 GB eMMC Storage
    • Neural network accelerator up to 2.3 TOPS
    • Supports Yocto Linux, Android and Microsoft Windows 10 IoT Base
  • The MIO-5376 is a 3.5" Single Board Computer based on the AMD Ryzen V2000 Embedded Processor Family
    • AMD RYZEN™ V2000 embedded Processor Family (R2314 4C/4T or R2514 4C/8T)
    • Up to 32 GB LPDDR4 memory in 2x DDR4 SODIMM Modules
    • 3x Intel® i225, 10/100/1000Base-T Gigabit LAN
    • 1x HDMI 2.0, 1xDP1.4/DP++ (1x HDMI 2.0b 4K x 2K 60Hz, 1x DP1.4/DP++ 4096x2304x36bpp@60Hz or 5120x3200x24bpp@60Hz), 1x LVDS/eDP 1080P
    • 3x M.2 expansion ports
    • 2x USB 3.2 Gen2, 2x USB 3.2 Gen 2, 2x USB 2.0
    • 4x Serial COM (2x RS-232/422/485 & 2x RS232)
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