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  • The SOM-2569 SMARC 2.0/2.1 Computer-on-Module is equipped with Intel® Atom™ processor E3900/Celeron or Pentium N series processor and up to 8 GB RAM, optional up to 64GB eMMC. With industrial temperature range support of -40°C to +85°C, measure only 82mm x 50mm and have an especially low-profile design thanks to the use of edge card connectors.
    • Intel ATOM E3900, Celeron or Pentium N Series SOC
    • up to 8GB DDR3L onboard
    • 2x USB 3.0 & 6x USB 2.0
    • up to 64GB eMMC Flash, SDIO, SATA
    • on SOM WIFI & Bluetooth Optional
    • Industrial Temperature Option
  • ROM-DB5901 SMARC Development carrier board designed for evaluation of the SMARC v2.0 modules. It supports a wide range of operating temperatures, two power input interfaces, and two MIPI connectors for the camera module. ROM-DB5901 is an ideal development board for mobile applications, such as portable devices, industrial tablets or HMI systems.
    • 4 kinds of display outputs, 18/24-bit LVDS or MIPI DSI, HDMI, DP
    • 2x MIPI-SCI2 interfaces for camera module
    • Supports +12V DC and lithium-ion battery power input
    • Operating Temperature -40°C to 85°C
  • The ROM-5722 NXP IMX8M Plus SMARC 2.1 Computer-on-Module is powered by NXP i.MX8M Plus SOC which includes up to 4 Arm Cortex-A53 cores in combination with one Cortex-M7 real-time processor and Vivante GC7000UL graphics engine. The ROM-5722 industrial ARM System-On-Module provides USB2.0, USB3.2 Gen1By1, dual Gigabit Ethernet, MIPI-CSI, PCI Express, and Dual channel LVDS shared with MIPI-DSI for embedded applications.
    • NXP i.MX 8M Plus processor with dual or quad ARM Cortex A53 cores
    • 1x Arm Cortex-M7 core
    • up to 6 GB LPDDR4 Onboard memory and 16 GB eMMC Storage
    • Neural network accelerator up to 2.3 TOPS
    • Supports Yocto Linux, Android and Microsoft Windows 10 IoT Base
  • The DEV-SOM36 PTP IEEE 1588V2 Development Ki,  has the TI DP83640 IEEE 1588 PTP PHYTER onboard, including an optional 4.3 inch WQVGA (480 x 272) TFT color LCD and a resistive touch screen for HMI applications.
    • Dual TI DP83640 PTP IEEE-1588v2 Precision Time Protocol PHY
    • Atmel ARM Cortex A5 ATSAMA5D36 536MHz
    • EMAC OE Linux, Real-time extensions
  • SOM-6872 COM Express Type 6 module is equipped with an AMD Ryzen™ Embedded V2000 SoC. This module delivers excellent performance and supports 8 x cores, 16 x threads, turbo boost (up to 4.25GHz), and 4 x independent 4K displays. Featuring built-in I/O interfaces and facilitates excellent graphic performance without requiring additional graphics cards.
    • AMD Ryzen Embedded V2000
    • Up to 64 GB DDR4 in 2x SODIMM
    • High Definition Audio Interface
  • The SSOM-1062M RT1062 ARM Microcontroller SoM is an ARM System on Module (SoM) based on the RT1062 Microcontroller (MCU)
    • RT1062 ARM CortexM7 600 MHz Crossover MCU Microcontroller Processor
    • 2x 100-BaseT Ethernet Ports(1x with PHY in module, 1x RMII output)
    • 1x Wifi/Bluetooth Radio (Optional)
    • Industrial Temperature -40 to +85
  • The DEV-710AIL-NANO NVIDIA Jetson Nano AI Development Kit. The MIC-710AIL-DVA1 supports deep learning trained models.
    • NVIDIA Jetson Nano embedded
    • Quad-Core ARM Cortex A57 MPCore NEON
    • Maxwell 128 CUDA Core Vulkan 1.1 GPU
    • Linux OS with BSP (board support package)
    • Supports deep learning trained models
  • The SOM-7583 is a Intel® 11th Gen Core Processors COM Express Mini Module Type10
    • COMe Mini Type-10
    • Intel® Tiger Lake UP3 processors
    • 16GB LPDDR4X 4266MT/s and IBECC support
    • USB4 Compliance supported by carrier board design
    • NVMe SSD onboard
    • Operating temperatures: Standard 0 ~ 60 °C (32 ~140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F)
    • Supports SUSI, DeviceOn and Edge AI Suite
  • The SOM-ETX-DEV is versatile SOM Carrier/Socket board ideal for evaluation and early development work. This Carrier is designed to work with ETX SOM Modules, specifically the SOM-VDX3-ETX. The SOM-ETX-DEV provides access to all the SOM's I/O through on-board connectors.

    Although a good deal of customers will want a Custom Carrier that is unique and is designed specifically for their application, the SOM-ETX-DEV when coupled with an ETX SOM makes for a nice Mini-ITX compatible embedded PC.

    • PICMG ETX 3.0 Pin out
    • ETX 114x95mm module
    • VGA, LVDS, PCI, IDE, ISA, USB
  • SOM-5871 AMD Ryzen Embedded SOM is equipped with the latest and first 14nm AMD Ryzen Embedded V1000 Processor (12-54W TDP) with up to four cores and eight threads. The AMD "Zen" core micro-architecture on the new COM Express (PICMG COM.0) R3.0 Type 6 basic module provides high computing power, and advanced graphics performance. SOM-5871 adopts 10/100/1000 Mbps speeds Ethernet controller and flexible I/O interface options with: 1 x PCIex4, 3 x PCIex1 through a PCIe Bridge, 2 x SATA Gen. 3 @ 6.0Gb/s, 3 x USB 3.0, 8 x USB 2.0 via USB Hub, 2 x COM ports (2-Wire), TPM 2.0, CAN Bus function (optional support), watchdog timer, and GPIO to fulfill a wide variety of functions and high performance system extension requirements. And for better structural integrity, SOM-5871 added an extra mounting hole design around the CPU for a stronger board structure that avoids board bending and improves thermal throughput to fulfill higher CPU TDP requirements.
    • AMD Ryzen Embedded V1000
    • Up to 32 GB DDR4 in 2x SODIMM
    • Gigabit Ethernet with Intel® Controller
    • High Definition Audio Interface
    • 2x SATA III 6.0 Gb/s
    • 8x USB 2.0, 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1
    • PCI-Express 1x PEG PCIex8, 6x PCIe [x1] lanes
    • COM Express Basic Module, Pin-out Type 6, COM R3.0
    • Variations Include: SOM-5871VC-H3, SOM-5871VC-H2, SOM-5871VC-U0, SOM-5871VC-U3, SOM-5871VCX-U1
  • The SOM-6883 series feature 11th Gen Intel® Core™/Celeron processors that leverage 14nm process technology. These solutions support DDR4 3200MT/s with 1.2V power design, up to 16GB memory down, and 32GB SO-DIMM. In addition, SOM-6883 augments memory capacity configuration via an i7-1185G7E SKU upgrade to quad-core.
    • 11th Generation Intel® Core™ Processor U-Series
    • COM Express R3.0 Compact Module Type 6 Pinout
    • Dual channel with one memory down and one SODIMM
    • High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2
    • Onboard NVMe x4 SSD up to 64GB, TPM2.0
    • Supports SUSI, DeviceOn and Edge AI Suite
    • Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M
    • Intel Iris Xe(Gen 12) graphics, 4 independent 4K display
    • Dual channel DDR4 Max 128GB SODIMM, support ECC
    • Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE(w/TSN), SATA3 (6Gb)
    • TPM2.0 security protection, onboard NVMe SSD fast & anti-vibration
    • Supports iManager, Edge-AI Suite, DeviceOn
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