- Renesas 1.20 GHz ARM64 Dual-Core Cortex-A55 CPU
- Includes 200 Mhz Cortex-M33 CoProcessor
- Up to 64 of eMMC Flash & Up to 4 GB of DDR4 RAM
- 24-bit LCD Controller with H.264 CODEC Resistive Touch
- MIPI-CIS-2 4x Lanes, MIPI-DSI 4x Lanes
- Dual Ethernet, 4x Serial Ports
- Wide Temperature -40 to +85
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Preliminary - The SoM-RZG2L is an ARM64 System on Module (SoM) based on the Renesas RZ/G2L 64-bit ARM Cortex-A55 Dual-Core processor. Designed and manufactured in the USA, this Industrial temperature 1.20 GHz SoM utilizes 16MB of Serial Data Flash, 8GB of eMMC Flash (up to 64GB optional) and 4GB of DDR4 RAM.
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Preliminary - The SoM-RZG2N is a System on Module (SoM) based on the Renesas RZ/G2N ARM64 Cortex-A57 Dual-Core 1.5GHz processor with ARM Cortex-R7 800MHz Core. This Multicore Application processor is the basis for our Computer-on-module. Designed and manufactured in the USA, this embedded SOM is ready to power your Embedded Artificial Intelligence systems, by putting AI into Industrial operating conditions.
- RZ/G2N ARM64 Cortex-A57 Dual-Core @ 1.5GHz + Cortex-R7 @ 800MHz
- HDMI & LVDS Dual Video with Touch Controller
- CSI and DSI Camera and Display connections
- 1000 BaseT Gigabit Ethernet, USB 3.0, PCIe, & SDIO Ports
- 4x Serial Ports, A/D, 2x SPI, 2x I2C, 2x I2S & 2x CAN
- 60 pin SOC specific Expansion Connector
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Preliminary - The SoM-RZV2L is an ARM64 System on Module (SoM) based on the Renesas RZ/V2L ARM Cortex-A55 Dual-Core processor, with Built-in AI accelerator DRP-AI for Vision and a Cortex-M33 core. Designed and manufactured in the USA, this Industrial temperature 1.20 GHz SoM utilizes 16MB of Serial Data Flash, 8GB of eMMC Flash (up to 64GB optional) and up to 4 GB of DDR4 RAM.
- Renesas 1.20 GHz ARM Dual-Core Cortex-A55 CPU
- DRP-AI AI accelerator & AI-MAC
- 8/16GB of eMMC Flash & up to 4 GB of DDR4 RAM
- 24-bit LCD Controller with H.264 CODEC Resistive Touch
- MIPI-CIS-2 4x Lanes, MIPI-DSI 4x Lanes
- Dual Ethernet, 4x Serial Ports
- Wide Temperature -40 to +85
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Preliminary - The SoM-RZG2H is a System on Module (SoM) based on the Renesas RZ/G2H ARM64 Cortex-A57 Dual-Core 1.5GHz processor & Quad-Core Cortex-A53 1.2GHz with ARM Cortex-R7 800MHz Core. This Multicore Application processor is the basis for our Computer-on-module. Designed and manufactured in the USA, this embedded SOM is ready to power your Embedded Artificial Intelligence systems, by putting AI into Industrial operating conditions.
- RZ/G2H ARM64 Cortex-A57 Dual-Core @ 1.5GHz + Quad-Core Cortex-A53 1.2GHz + Cortex-R7 @ 800MHz
- HDMI & LVDS Dual Video with Touch Controller
- CSI and DSI Camera and Display connections
- 1000 BaseT Gigabit Ethernet, USB 3.0, PCIe, & SDIO Ports
- 4x Serial Ports, A/D, 2x SPI, 2x I2C, 2x I2S & 2x CAN
- 60 pin SOC specific Expansion Connector
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Preliminary- The SOM-950AX Industrial temperature Carrier board for NVIDIA Jetson AGX Orin offers 3x USB 3.2 Type-C ports, Dual-Gigabit LAN ports, M.2 2280 M-Key NVMe slot for storage and an M.2 2230 E-Key slot for expansion on a minimal sized carrier board.. The SOM-950AX Carrier for Jetson AGX Orin™ is a compact sized full-featured carrier board specifically designed for commercially deployable platforms. FEATURES
- NVIDIA Jetson AGX Orin embedded
- NVIDIA 699 pin B2B Connector
- 1x M.2 2280 M-Key NVMe for storage
- 2x 1000 BASE-T LAN RJ45 (Dual Gigabit Ethernet)
- 8x MIPI-CSI2 2-LANE or 4x MIPI-CSI2 4-LANE Cameras)
- 3x USB 3.2 Type-C, 1x USB OTG, 1x UART, 1x CAN-FD
- NVIDIA Jetson AGX Orin embedded
