Description
Preliminary – The SoM-RZV2L is an ARM64 Embedded AI System on Module (SoM) based on the Renesas RZ/V2L ARM Cortex-A55 Dual-Core processor, with Built-in AI accelerator DRP-AI for Vision and a Cortex-M33 core. Designed and manufactured in the USA, this industrial temperature Dual-Core 1.20 GHz SoM utilizes 16MB of Serial Data Flash, 8GB of eMMC Flash (up to 64GB optional) and has up to 4 GB of DDR4 RAM. Additional Flash storage can be had using the module’s SDIO interface allowing the use of external SD flash cards.
The SoM-RZV2L ARM64 Embedded AI SOM is based on the Renesas RZ/V2L ARM Cortex-A55 Dual-Core processor, with Built-in AI accelerator DRP-AI for Vision and a Cortex-M33 core providing dual 1.20GHz Cortex-A55 Cores and an additional 200MHz Cortex-M33 Processor core.
The Renesas RZ/V2L processor offers the following features:
- Cortex-A55 (Dual or Single)
- Cortex-M33
- DRP-AI AI accelerator
- 3D Graphics engine (Arm Mali-G31)
- Video Codec (H.264)
- Camera interface (MIPI-CSI-2 4x Lanes)
- Display interface (MIPI-DSI 4x Lanes)
- USB 2.0, USB OTG, 2x SDIO interface
- CAN interface (CAN-FD)
- Gigabit Ethernet 2x 1000BaseT LANÂ connections
Applications:
- Home Appliance
- Industrial HMI
- Intercom/ Doorbell
- Point of Sales
- Smart Thermostat
- Smart Camera
The SoM-RZV2L ARM64 Embedded AI SOM has 4x Serial Ports, Dual Gigabit Ethernet(1000 BaseT PHY with MAC and 1000 BaseT RGMII), 2x USB 2.0 High-Speed Host Ports, 1x USB 2.0 High-Speed OTG/Host/Device Port, 8x channels of 12 bit A/D(4x A/D Channels Muxed with 4-Wire Resistive Touch Controller), 4-Lane MIPI-DSI, 4-Lane MIPI-CSI-2 interface and a 24-bit LCD Controller. The module also features an Internal Real Time Clock/Calendar with external battery backup provision, 14x GPIO Lines, and 2x Timer/Counters/PWM. The SoM-RZV2L has 1x Synchronous Serial I/O (I2S) Audio port, 2x SPI Ports with 4 slave selects, 1x I2C Port, 2x CAN-FD Ports, SDIO, and on module status (software controlled) LED.
AI performance in an Embedded solution, the DRP-AI processor is a Dynamically Reallocated Processor. This DRP-AI consists of AI-MAC (multiply-accumulate processor) and DRP (reconfigurable processor). AI processing can be executed at high speed by assigning AI-MAC for operations on the convolution layer and fully connected layer, and DRP for other complex processing such as preprocessing and pooling layer. DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently not only in consumer electronics and industrial equipment but also in a wide range of applications such as point-of-sale (POS) terminals for retail. Also, the DRP-AI provides both real-time AI inference and image processing functions with the capabilities essential for camera support such as color correction and noise reduction. This enables customers to implement AI-based vision applications without requiring an external image signal processor (ISP).
Using the same small 200-pin Gen2 SODIMM form factor utilized by other EMAC SoM modules, the SoM-RZV2L is the ideal processor engine for your next design. All of the ARM processor core functionality is included on this tiny board including: Flash, Memory, Serial Ports, Dual Gigabit Ethernet, CSI, DSI, I2S Audio, PWMs, Timer/Counters, A/D, digital I/O lines, Clock/Calendar, and more.
The SoM-RZV2L is designed to plug into a carrier board that contains all the connectors and any custom I/O required for the application. This approach allows the customer or EMAC to design a custom carrier board that meets the I/O, dimensional, and connector requirements without having to worry about the processor, memory, and standard I/O functionality. With this System on Module approach, a semi-custom hardware platform can be developed in as little as a month.
In addition to the option of developing a custom carrier board, one can be purchased off-the-shelf from EMAC. EMAC provides off-the-shelf Carrier boards that feature A/D, D/A, MMC/SD card, keypad, LCD, Audio, and Modem interfaces. The recommended off-the-shelf carrier board for the SoM-RZV2L is the SOM-255GS which allows you to immediately start coding your application using EMAC OE Linux and Qt Development tools.
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EMAC is a global leader in system on module and carrier board embedded systems. The System on Module (SoM) is an ideal alternative to custom engineering. With the SoM approach you get the best of aspects of both buying an Off-The-Shelf Embedded Single Board Computer (SBC) and a Custom Engineered solution. With Off-The-Shelf embedded components such as a generic carrier board and SOM module, it is possible to start development on your software applications before the custom carrier board is complete; thus offering a reduced time to market for your system. A System on Module (SoM) is comprised of a small processor module with CPU bus accessibility and standard I/O functionality. The SoM module does not have any connectorization and is designed to be plugged into a Carrier Board.
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