- NVIDIA Jetson AGX Orin embedded
- NVIDIA 699 pin B2B Connector
- 1x M.2 2280 M-Key NVMe for storage
- 2x 1000 BASE-T LAN RJ45 (Dual Gigabit Ethernet)
- 8x MIPI-CSI2 2-LANE or 4x MIPI-CSI2 4-LANE Cameras)
- 3x USB 3.2 Type-C, 1x USB OTG, 1x UART, 1x CAN-FD
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Preliminary- The SOM-950AX Industrial temperature Carrier board for NVIDIA Jetson AGX Orin offers 3x USB 3.2 Type-C ports, Dual-Gigabit LAN ports, M.2 2280 M-Key NVMe slot for storage and an M.2 2230 E-Key slot for expansion on a minimal sized carrier board.. The SOM-950AX Carrier for Jetson AGX Orin™ is a compact sized full-featured carrier board specifically designed for commercially deployable platforms. FEATURES
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Preliminary - The SoM-RZG2H is a System on Module (SoM) based on the Renesas RZ/G2H ARM64 Cortex-A57 Dual-Core 1.5GHz processor & Quad-Core Cortex-A53 1.2GHz with ARM Cortex-R7 800MHz Core. This Multicore Application processor is the basis for our Computer-on-module. Designed and manufactured in the USA, this embedded SOM is ready to power your Embedded Artificial Intelligence systems, by putting AI into Industrial operating conditions.
- RZ/G2H ARM64 Cortex-A57 Dual-Core @ 1.5GHz + Quad-Core Cortex-A53 1.2GHz + Cortex-R7 @ 800MHz
- HDMI & LVDS Dual Video with Touch Controller
- CSI and DSI Camera and Display connections
- 1000 BaseT Gigabit Ethernet, USB 3.0, PCIe, & SDIO Ports
- 4x Serial Ports, A/D, 2x SPI, 2x I2C, 2x I2S & 2x CAN
- 60 pin SOC specific Expansion Connector
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Preliminary - The SoM-RZV2L is an ARM64 System on Module (SoM) based on the Renesas RZ/V2L ARM Cortex-A55 Dual-Core processor, with Built-in AI accelerator DRP-AI for Vision and a Cortex-M33 core. Designed and manufactured in the USA, this Industrial temperature 1.20 GHz SoM utilizes 16MB of Serial Data Flash, 8GB of eMMC Flash (up to 64GB optional) and up to 4 GB of DDR4 RAM.
- Renesas 1.20 GHz ARM Dual-Core Cortex-A55 CPU
- DRP-AI AI accelerator & AI-MAC
- 8/16GB of eMMC Flash & up to 4 GB of DDR4 RAM
- 24-bit LCD Controller with H.264 CODEC Resistive Touch
- MIPI-CIS-2 4x Lanes, MIPI-DSI 4x Lanes
- Dual Ethernet, 4x Serial Ports
- Wide Temperature -40 to +85
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Preliminary - The SoM-RZG2N is a System on Module (SoM) based on the Renesas RZ/G2N ARM64 Cortex-A57 Dual-Core 1.5GHz processor with ARM Cortex-R7 800MHz Core. This Multicore Application processor is the basis for our Computer-on-module. Designed and manufactured in the USA, this embedded SOM is ready to power your Embedded Artificial Intelligence systems, by putting AI into Industrial operating conditions.
- RZ/G2N ARM64 Cortex-A57 Dual-Core @ 1.5GHz + Cortex-R7 @ 800MHz
- HDMI & LVDS Dual Video with Touch Controller
- CSI and DSI Camera and Display connections
- 1000 BaseT Gigabit Ethernet, USB 3.0, PCIe, & SDIO Ports
- 4x Serial Ports, A/D, 2x SPI, 2x I2C, 2x I2S & 2x CAN
- 60 pin SOC specific Expansion Connector
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Preliminary - The SoM-RZG2L is an ARM64 System on Module (SoM) based on the Renesas RZ/G2L 64-bit ARM Cortex-A55 Dual-Core processor. Designed and manufactured in the USA, this Industrial temperature 1.20 GHz SoM utilizes 16MB of Serial Data Flash, 8GB of eMMC Flash (up to 64GB optional) and 4GB of DDR4 RAM.
- Renesas 1.20 GHz ARM64 Dual-Core Cortex-A55 CPU
- Includes 200 Mhz Cortex-M33 CoProcessor
- Up to 64 of eMMC Flash & Up to 4 GB of DDR4 RAM
- 24-bit LCD Controller with H.264 CODEC Resistive Touch
- MIPI-CIS-2 4x Lanes, MIPI-DSI 4x Lanes
- Dual Ethernet, 4x Serial Ports
- Wide Temperature -40 to +85
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Preliminary - The SoM-255G2 SoM Development Carrier Board with 4-lane CSI, DSI, 802.11 a/b/g/n Wi-Fi, Bluetooth 5.1, Dual-ethernet, packaged as a Panel PC with the optional 7” or 10" color LCD and resistive touch screen. Note: The SoM-255G2 is specifically designed for SoMs with Video, CSI, USB and Dual-Ethernet capabilities.
- Available with 7" WVGA 800 x 480 Graphic LCD with Touch Screen
- Available with 10" WSVGA 1024 X 600 Graphic LCD with Touch Screen
- 4-lane CSI
- 3x RS232 & 1x RS232/422/485 Port
- 2x USB 2.0 Host port, 1 USB 2.0 OTG port
- Wireless 802.11 a/b/g/n & Bluetooth 5.1; TI WL1807MOD Wireless
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The ROM-2620 OSM 1.1 Computer-on-Module is powered by NXP i.MX 8ULP SoC which includes up to 2 Arm Cortex-A35 cores in combination with one Cortex-M33 real-time processor and Vivante GC7000 nanoULTRA/GC328 graphics engine. It provides USB2.0, Fast Ethernet, MIPI-CSI, I2C, SPI, GPIO, PWM and MIPI DSI display for embedded applications.
- NXP Arm® Cortex®-A35 i.MX 8ULP Dual up to 1.0 GHz with 1x Arm Cortex-M33 core
- Onboard LPDDR4 1GB, 2000MT/s memory
- 1x 4 lane MIPI-DSI
- 1x USB2.0, 1x USB 2.0 OTG, 5x UART, 2x I2C, 24 x GPIO, 6x PWM, 1x CAN
- Ultra-small size form factor - OSM
- Support Ycoto Linux
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Preliminary - The SoM-35D1F is an ARM64 System on Module (SoM) based on the NuvoTon NuMicro® MA35D1 with dual 64-bit Arm® Cortex®-A35 cores and one 180 MHz Arm® Cortex®-M4 core. Designed and manufactured in the USA by EMAC, Inc; this This Industrial Temperature dual-core 800MHz SoM utilizes 32MB of Serial Data Flash, 4GB of eMMC Flash (up to 64GB optional) and has 512MB of DDR3L RAM built into the MA35D1 processor.
- NuvoTon 800MHz ARM Cortex-A35 Dual-Core CPU
- Includes 180Mhz Cortex-M4 CoProcessor
- 4/16GB of eMMC Flash & 512MB of DDR3 RAM
- 24-bit LCD Controller with Resistive Touch
- 4x CSI Lanes
- Dual Ethernet, 4x Serial Ports
- Wide Temperature -40 to +85
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The SOM-AGX201 Forge Carrier board for NVIDIA Jetson AGX Orin™ is a full featured carrier board specifically designed for commercially deployable platforms.
- NVIDIA Jetson AGX Orin embedded
- 2x 1GBASE-T LAN RJ45 (1G Ethernet)
- 2x 10GBASE-T LAN RJ45 (10G Ethernet)
- 1x USB 3.2 Type-C, 1x USB 3.2 Type-C OTG Capable
- 1x Display port output
- 1x 16-lane MIPI Expansion connector (for MIPI CSI, GMSL2 or FPD-Link III image sensors)
- Linux OS with BSP (board support package)
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The SOM-AGX202 Rogue Carrier for Jetson AGX Orin™ is a full featured carrier board specifically designed for commercially deployable platforms. FEATURES
- Commercially deployable NVIDIA Jetson AGX Orin or AGX Orin Industrial
- 2048 Core Ampere GPU with 64 Tensor Cores and bringing 248 TOPS+ (Jetson AGX Orin Industrial)
- This AI ready Carrier board brings the processing abilities to launch the next generation of AI systems
- Linux OS with BSP (board support package)
- Supports deep learning trained models
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SOM-NX8MM D168, ARM System On Module, Based on the NXP IMX 8M Mini processor is a SOM ready for your industrial application,
- NXP ARM Cortex™ A53 i.MX 8M Mini Quad Core Processor
- 4x USB 2.0 Ports
- up to 2x Gigabit Ethernet ports
- 4x Serial ports
- HDMI/MIPI-DSI, MIPI-CSI
- Low Power Consumption
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The SoM-5728M is a System on Module (SoM) based on the Texas Instruments AM5728 Dual-Core ARM Cortex A15 processor. This Multi-core Real-time Application processor is Designed and manufactured in the USA.
- AM5728/AM/5729 ARM Cortex A15 1.5GHz
- 2x Cortex M4 RT Cores at 213 MHz
- With up to 2GB RAM and 64 GB of eMMC Flash
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The SOM-2569 SMARC 2.0/2.1 Computer-on-Module is equipped with Intel® Atom™ processor E3900/Celeron or Pentium N series processor and up to 8 GB RAM, optional up to 64GB eMMC. With industrial temperature range support of -40°C to +85°C, measure only 82mm x 50mm and have an especially low-profile design thanks to the use of edge card connectors.
- Intel ATOM E3900, Celeron or Pentium N Series SOC
- up to 8GB DDR3L onboard
- 2x USB 3.0 & 6x USB 2.0
- up to 64GB eMMC Flash, SDIO, SATA
- on SOM WIFI & Bluetooth Optional
- Industrial Temperature Option
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ROM-DB5901 SMARC Development carrier board designed for evaluation of the SMARC v2.0 modules. It supports a wide range of operating temperatures, two power input interfaces, and two MIPI connectors for the camera module. ROM-DB5901 is an ideal development board for mobile applications, such as portable devices, industrial tablets or HMI systems.
- 4 kinds of display outputs, 18/24-bit LVDS or MIPI DSI, HDMI, DP
- 2x MIPI-SCI2 interfaces for camera module
- Supports +12V DC and lithium-ion battery power input
- Operating Temperature -40°C to 85°C
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The ROM-5722 NXP IMX8M Plus SMARC 2.1 Computer-on-Module is powered by NXP i.MX8M Plus SOC which includes up to 4 Arm Cortex-A53 cores in combination with one Cortex-M7 real-time processor and Vivante GC7000UL graphics engine. The ROM-5722 industrial ARM System-On-Module provides USB2.0, USB3.2 Gen1By1, dual Gigabit Ethernet, MIPI-CSI, PCI Express, and Dual channel LVDS shared with MIPI-DSI for embedded applications.
- NXP i.MX 8M Plus processor with dual or quad ARM Cortex A53 cores
- 1x Arm Cortex-M7 core
- up to 6 GB LPDDR4 Onboard memory and 16 GB eMMC Storage
- Neural network accelerator up to 2.3 TOPS
- Supports Yocto Linux, Android and Microsoft Windows 10 IoT Base
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The DEV-SOM36 PTP IEEE 1588V2 Development Ki, has the TI DP83640 IEEE 1588 PTP PHYTER onboard, including an optional 4.3 inch WQVGA (480 x 272) TFT color LCD and a resistive touch screen for HMI applications.
- Dual TI DP83640 PTP IEEE-1588v2 Precision Time Protocol PHY
- Atmel ARM Cortex A5 ATSAMA5D36 536MHz
- EMAC OE Linux, Real-time extensions
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SOM-6872 COM Express Type 6 module is equipped with an AMD Ryzen™ Embedded V2000 SoC. This module delivers excellent performance and supports 8 x cores, 16 x threads, turbo boost (up to 4.25GHz), and 4 x independent 4K displays. Featuring built-in I/O interfaces and facilitates excellent graphic performance without requiring additional graphics cards.
- AMD Ryzen Embedded V2000
- Up to 64 GB DDR4 in 2x SODIMM
- High Definition Audio Interface
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The SSOM-1062M RT1062 ARM Microcontroller SoM is an ARM System on Module (SoM) based on the RT1062 Microcontroller (MCU)
- RT1062 ARM CortexM7 600 MHz Crossover MCU Microcontroller Processor
- 2x 100-BaseT Ethernet Ports(1x with PHY in module, 1x RMII output)
- 1x Wifi/Bluetooth Radio (Optional)
- Industrial Temperature -40 to +85
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The DEV-710AIL-NANO NVIDIA Jetson Nano AI Development Kit. The MIC-710AIL-DVA1 supports deep learning trained models.
- NVIDIA Jetson Nano embedded
- Quad-Core ARM Cortex A57 MPCore NEON
- Maxwell 128 CUDA Core Vulkan 1.1 GPU
- Linux OS with BSP (board support package)
- Supports deep learning trained models
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The SOM-7583 is a Intel® 11th Gen Core Processors COM Express Mini Module Type10
- COMe Mini Type-10
- Intel® Tiger Lake UP3 processors
- 16GB LPDDR4X 4266MT/s and IBECC support
- USB4 Compliance supported by carrier board design
- NVMe SSD onboard
- Operating temperatures: Standard 0 ~ 60 °C (32 ~140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F)
- Supports SUSI, DeviceOn and Edge AI Suite
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The SOM-ETX-DEV is versatile SOM Carrier/Socket board ideal for evaluation and early development work. This Carrier is designed to work with ETX SOM Modules, specifically the SOM-VDX3-ETX. The SOM-ETX-DEV provides access to all the SOM's I/O through on-board connectors.
Although a good deal of customers will want a Custom Carrier that is unique and is designed specifically for their application, the SOM-ETX-DEV when coupled with an ETX SOM makes for a nice Mini-ITX compatible embedded PC.
- PICMG ETX 3.0 Pin out
- ETX 114x95mm module
- VGA, LVDS, PCI, IDE, ISA, USB
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SOM-5871 AMD Ryzen Embedded SOM is equipped with the latest and first 14nm AMD Ryzen Embedded V1000 Processor (12-54W TDP) with up to four cores and eight threads. The AMD "Zen" core micro-architecture on the new COM Express (PICMG COM.0) R3.0 Type 6 basic module provides high computing power, and advanced graphics performance. SOM-5871 adopts 10/100/1000 Mbps speeds Ethernet controller and flexible I/O interface options with: 1 x PCIex4, 3 x PCIex1 through a PCIe Bridge, 2 x SATA Gen. 3 @ 6.0Gb/s, 3 x USB 3.0, 8 x USB 2.0 via USB Hub, 2 x COM ports (2-Wire), TPM 2.0, CAN Bus function (optional support), watchdog timer, and GPIO to fulfill a wide variety of functions and high performance system extension requirements. And for better structural integrity, SOM-5871 added an extra mounting hole design around the CPU for a stronger board structure that avoids board bending and improves thermal throughput to fulfill higher CPU TDP requirements.
- AMD Ryzen Embedded V1000
- Up to 32 GB DDR4 in 2x SODIMM
- Gigabit Ethernet with Intel® Controller
- High Definition Audio Interface
- 2x SATA III 6.0 Gb/s
- 8x USB 2.0, 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1
- PCI-Express 1x PEG PCIex8, 6x PCIe [x1] lanes
- COM Express Basic Module, Pin-out Type 6, COM R3.0
- Variations Include: SOM-5871VC-H3, SOM-5871VC-H2, SOM-5871VC-U0, SOM-5871VC-U3, SOM-5871VCX-U1
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The SOM-6883 series feature 11th Gen Intel® Core™/Celeron processors that leverage 14nm process technology. These solutions support DDR4 3200MT/s with 1.2V power design, up to 16GB memory down, and 32GB SO-DIMM. In addition, SOM-6883 augments memory capacity configuration via an i7-1185G7E SKU upgrade to quad-core.
- 11th Generation Intel® Core™ Processor U-Series
- COM Express R3.0 Compact Module Type 6 Pinout
- Dual channel with one memory down and one SODIMM
- High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2
- Onboard NVMe x4 SSD up to 64GB, TPM2.0
- Supports SUSI, DeviceOn and Edge AI Suite
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- Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M
- Intel Iris Xe(Gen 12) graphics, 4 independent 4K display
- Dual channel DDR4 Max 128GB SODIMM, support ECC
- Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE(w/TSN), SATA3 (6Gb)
- TPM2.0 security protection, onboard NVMe SSD fast & anti-vibration
- Supports iManager, Edge-AI Suite, DeviceOn
