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  • The DEV-710AIL-NANO NVIDIA Jetson Nano AI Development Kit. The MIC-710AIL-DVA1 supports deep learning trained models.
    • NVIDIA Jetson Nano embedded
    • Quad-Core ARM Cortex A57 MPCore NEON
    • Maxwell 128 CUDA Core Vulkan 1.1 GPU
    • Linux OS with BSP (board support package)
    • Supports deep learning trained models
  • The COMe-cAL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. A broad range of module variants, based on five different processor types, make up the COMe-cAL6 portfolio. Versions range from a cost optimized dual-core Intel Celeron (2x 1.1/2.4 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.6/2.0 GHz with 12W TDP) and Intel Pentium (4x 1.1/2.5 GHz with 6W TDP) versions for high-end applications.
    • Intel Apollo Lake Pentium, Celeron, Atom E3900
    • Low-power – performance/watt optimized form factor solution
    • 2x SODIMM Up to 8 GByte DDR3L
    • Triple Display outputs
    • Industrial grade temperature
  • COM-UCEBT adopts the latest Intel® Bay Trail Atom™ N2000/E3800 processor. The system memory deploys with onboard DDR3L 2 GB memory. In addition, Intel® I211/i210 supports 10/100/1000Base-TX that allows faster network connections. This model applies three PCI-Express〔x1〕, one LPC bus, and one SMBus. Moreover, two SATA 3.0Gb/s are configured on the COM-UCEBT. COM-UCEBT also equips six USB2.0 and one USB2.0/3.0 bus for flexible I/O expansions. The display of COM-UCEBT supports CRT/LCD simultaneous/ dual view display. This brand new COM Express Module is developed to cater to the requirements of Automation, Medical, ticket machine, transportation, gaming, KIOSK, and POS/POI applications.
    • Intel® Atom™ E3800 Product Family/Celeron® N2000 Series SoC Processor
    • COM Express Pin-out Type 10
    • Onboard DDR3L 2 GB Memory
    • Gigabit Ethernet
    • 18/24-bit Single Channel LVDS LCDs & DDI
    • 2x SATA, eMMC (Optional)
    • 1x USB 2.0/USB 3.0 & 6 x USB2.0, GPIO 8-bit, 3 x PCI-Express [x1]
  • COM-BT CPU Board is a Type 6 COM Express module. It has an eDP interface allowing closed connection between the display device and the board ensuring that it is free from any external interference. COM-BT CPU Board is also capable of converting video signal through DDI0 and DDI1 going to DVI, DP, or HDMI gadgets or devices. COM-BT adopts the latest Intel® Celeron® J1900, N2930, N2807 and Atom™ E3800 Series product family. The system memory deploys with one DDR3L 1066/1333 MHz SODIMM up to 8 GB (4GB max for E3815/E3825/N2807). In addition, Intel® I211 supports Gigabit Ethernet that allows faster network connections. This model applies four PCI-Express〔x1〕 (one shared with Gigabit LAN). Moreover, two SATA 3.0Gb/s are configured on the COM-BT. COM-BT also equips USB2.0 x6, USB 3.2 Gen 1 x1 (combine USB2.0 x1) for flexible I/O expansions.
    • Intel® Atom™/ Celeron® Processor SoC
    • DDR3L 1066/1333 MHz SODIMM x 1, Up to 8 GB
    • Gigabit Ethernet with Intel® Controller
    • CRT, Up to 24-bit Dual-channel LVDS, eDP (Optional), up to DDI x 2 (Share w/ eDP LVDS)
    • High Definition Audio Interface
    • SATA 3.0 Gb/s x 2
    • USB 2.0 x 7, USB 3.2 Gen 1 x 1
    • PCI-Express [x1] x 3
    • COM Express Compact Module, Pin-out Type 6, COM.0 Rev. 2.1
  • The SMARC-sXBTi Computer-on-Modules has been developed to comply with the SGET specification and is equipped with Intel® Atom™ processor E3800 series and up to 8 GB RAM, optional with ECC. They support the extended temperature range of -40°C to +85°C, measure only 82mm x 50mm and have an especially low-profile design thanks to the use of edge card connectors. Nevertheless, there is still enough space for up a 64GB on-board SSD to store OS and application data.
    • Intel ATOM 3800 Series SOC
    • up to 8GB DDR3L onboard
    • 1x USB 3.0 & 3x USB 2.0
    • eMMC Flash, SDIO, 2x SATA
    • Industrial Temperature  Option
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